Hot sell ZX-C2 BGA rework station

ZX-C2 BGA rework station Features1.With three independent temperature zone control, upper and bottom main heater with hot air to heat, third zone with infrared to preheat;2.Upper and bottom heater with 8 segment temperature up (down)+8 segment constant temperature control, can store10 groups temperature curve; Upper, bottom heater and infrared start heating at the same time;3.Three heating zone with independent PID to control heating process, more stable and accurate.4.Bottom heater and IR preheating zone with supporter to prevent PCB part deformation;5.After remove and solder, using high-volume fan to cool the PCB board, prevent deformation of PCB board and ensure the effect of soldering;6.Equipped with a variety size of hot-air nozzle, or made according to special requirements;7.Build-in vacuum pump, no need gas source.SpecificationsPCBsize≤L540×W450mmPCB Thickness0.1 5mmTemperaturecontrolK Thermocouple, Closed loopPCB PositioningOuterSub (Bottom) heaterInfrared 2400WMain (Top+bottom) heaterHot air 800W+800WPower supplySingle phase 220V,50/60Hz,4.0KVAMachine dimensionL700*W515*H550mmWeight of machineApprox. 37kgs