Best-selling ZX-X5 BGA rework system

ZX-X5 BGA rework system Features 1.HD optical alignment system design,optical zoom up to 22 times;2.Alignment fine-tuning accuracy can be 0.01mm;3.Upper heater with hot air, bottom with hot air and IR to preheat; 4.Upper and bottom heater controlled by 8 segment temperature up (down)+8 segment constant temperature, can store 10 groups temperature profile;5.Three heating zone with independent PID to control heating process, more stable and accurate;6.Bottom heater and IR preheating zone with supporter to prevent welding zone part deformation;7.After removal and welding with cooling fan to cool PCB board, ensure welding effect;8.Equipped with various size of hot air nozzle; 9.Upper and bottom heater can 360 degree rotation, easy to replace; 10.Build-in vacuum pump, no need gas source. Specifications PCB Size≤L565×W510mmPCBThickness0.1 5mmTemperature ControlKthermocouple,closedFine-tuning accuracy0.01mmPCB PositioningOuterSub (Bottom) heaterInfrared 2400WMain (Top+bottom) heaterHot air 800W+800WPower supplySingle phase 220V,50/60Hz,4.0KVAMachine dimensionL700*W725*H960mmWeight of machineApprox. 90kgs